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Security & Chip Card ICs SLE 66CLX641P
16-Bit High Security Contactless Controller ISO/IEC 14443 Type A & B Compliant Interfaces For Contactless Operation with Memory Management and Protection Unit in 0.22 m CMOS Technology 136-Kbyte ROM, 5-Kbyte RAM, 64-Kbyte EEPROM 1100-Bit Advanced Crypto Engine supporting RSA and Elliptic Curve GF(p) 112-Bit / 192-Bit DDES-EC2 Accelerator supporting DES, 3DES and Elliptic Curve GF(2n)
Short Product Information
April 2004
SLE 66CLX641P Short Product Information
Ref.: SPI_SLE66CLX641P_0404.doc
This document contains preliminary information on a new product under development. Details are subject to change without notice. Revision History: Current Version 2004-04-27 Previous Releases: 2004-04-01 Page
Important: Further information is confidential and on request. Please contact: Infineon Technologies AG in Munich, Germany, Security & Chip Card ICs, Tel +49 - (0)89 234-80000 Fax +49 - (0)89 234-81000 E-Mail: security.chipcard.ics@infineon.com
Published by Infineon Technologies AG, SMS Security Applications Group St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 2004 All Rights Reserved. To our valued customers We constantly strive to improve the quality of all our products and documentation. We have spent an exceptional amount of time to ensure that this document is correct. However, we realise that we may have missed a few things. If you find any information that is missing or appears in error, please use the contact section above to inform us. We appreciate your assistance in making this a better document. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives world-wide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
SLE 66CLX641P
16-Bit High Security Contactless Controller ISO/IEC 14443 Type A &B Compliant Interfaces For Contactless Operation with MMU in 0.22 m CMOS Technology 136-Kbyte ROM, 5-Kbyte RAM, 64-Kbyte EEPROM 1100-Bit Advanced Crypto Engine supporting RSA and Elliptic Curve GF(p) and 112-Bit / 192-Bit DDES-EC2 Accelerator supporting DES, 3DES and Elliptic Curve GF(2n) Features
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Enhanced low power 8051 CPU with extended addressing modes for contactless smart card applications Instruction set opcode compatible with standard 8051 processor with additional powerful instructions optimized for smart card application Enhanced architecture with execution time 6 times faster (18 times using PLLmax) than standard 8051 processor at same external clock 134 Kbytes User ROM for operating system and application (programs & data) 2 Kbytes reserved ROM for Resource Management System (RMS_E) with Contactless Optimized EEPROM write/erase routines 64 Kbytes Secure EEPROM in SuperSlim technology for application program and data 4k bytes XRAM, 700 bytes Crypto-RAM and 256 bytes internal RAM for fast data processing Memory Management Unit Certified True Random Number Generator Dual Key Triple DES (DDES) & GF (2n) Elliptic Curve (EC2) Accelerator Advanced Crypto Engine for Elliptic Curve GF(p) and up to 2048 bits RSA computation CRC Module according to ISO/IEC 3309 supporting CCIT v.41 & HDLC X25 8 Interrupt Vectors Module with 3 priority levels to ensure real time operation
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PLL: to speed up the internal CPU clock frequency up to 15MHz (optional use) Two 16-bit Timer with interrupt capability for protocols, security checks & watch dog implementations Power saving sleep mode Temperature range: contact-less: -25C to +70C
Full operation of Contactless interface controlled by Operating System enhances Security Level Contactless Interface
Interface according to ISO/IEC 14443 for both Type A and Type B Carrier frequency 13.56 MHz Data rate 106 Kbit/s in type A operation up to 848 Kbit/s in type B operation Anticollision & Transmission Protocol supported by open source application notes for both Type A & B Flexible Internal CPU clock frequency: fully configurable from 1.7MHz up to 15 MHz 256 bytes buffer for contactless data exchange (FiFo circular architecture) Parallel operation of CPU, Peripherals like DES, CRC and Contactless Interface possible for High Demanding Contactless Applications
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SLE 66CLX641P
EEPROM (SuperSlim Technology)
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Secure chip and firmware design
Byte wise EEPROM programming and read accesses Versatile & Flexible page mode for 1 to 256 bytes write/erase operation 32 bytes security area including: - 16 bytes chip unique identification number - 16 bytes PROM area (OTP like) Fast personalisation mode 1.5 ms Typical Page Erase time < 2.5ms Typical Page Writing time < 1.8 ms Minimum of 100.000 Write/erase cycles1) Data retention for a minimum of 10 years1) EEPROM programming voltage generated on chip
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Memory Management and Protection Unit
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* Code execution from XRAM possible Security Features
Operation state monitoring mechanism
The chip goes in a secure reset state on any following sensors alarm: * Low and high voltage sensors * Internal voltage sensor * Frequency sensors and filters * Light sensor * Glitch sensor * Temperature sensor * Life Test Sensor * Internal power-on reset sensor * Active Shield with automatic and user controlled attack detection
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Addressable memory up to 1 Mbytes Separates OS (system mode) and Application (application mode) System routines called by traps Access Restrictions to peripherals in application mode controlled by OS
Security scrambled & optimized chip layout against physical chip manipulation Memory encryption/decryption module (MED) for XRAM, ROM and EEPROM against reverse engineering and power attacks ROM code not visible due to implantation Mask dependant ROM code encrypted during production Chip Unique encryption of the XRAM and EEPROM Flexible encryption of part or whole EEPROM by additional user-defined key 16 byte Unique chip identification number for anti-clone countermeasure & tracking 16 bytes security PROM hardware protected (OTP like) Secure start of the operating system ensured by certified Self Test Software (STS) Certified EEPROM programming routines (RMS_E) True Random Number Generator with Firmware test function High Speed SPA/DPA resistant Triple DES (DDES) Accelerator and Advanced Crypto Engine
Anti Snooping
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HW-countermeasures against SPA/DPA-, Timing- and DFA-attacks (differential fault analysis)
Supported Standards
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EMV 2000 ISO/IEC 14443 ISO/IEC 3309 CCIT v.41 HDLC X25
Values are temperature dependant
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SLE 66CLX641P
Application Support
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HW-& SW-Tools (Emulator, ROM Monitor, Card Emulator, Simulator, Evaluation Kit Proximity (Contactless Reader package), SmartMaskTM package, Simulated Reader Software, etc.) Open Source Application Notes Tutorial (e.g.: DES and 3DES, Crypto Library, Anticollision and Contactless Transmission Protocols for both Type A and B, Card Coil Design Guide, Card Coil Antenna Reference Design List, etc.) Certified CC EAL5+ Crypto Library Worldwide Application Engineer Team and customer dedicated Field Application Engineers Regular Customer trainings on Cryptography, Contactless and Dual interface controllers including ISO/IEC 14443 related topics On-site trainings available on request
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Chip Qualification report Chip delivery specification for wafer with chip-layout (die size, orientation, ...) Module specification containing description of package, etc. Module Qualification report
Development Tools Overview
Software Development Kit SDK CC Card Emulator CE66P Dual Interface ROM Monitor RM66P-II with stand alone functionality for ROM mask qualification in the end user system Emulator ET66P Hitex or ET66P KSC Smart MaskTM Package for chip evaluation Smart MaskTM Pure Contactless modules (supplied by Infineon) supporting both ISO/IEC 14443 Type A & B for implantation process testing and production setup Evaluation Kit Proximity (Contactless reader package)
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Document References
Confidential Data Book SLE 66CxxP Confidential Instruction Set SLE 66CxxP Confidential Quick Reference SLE 66CxxP
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Timing performances are independent of the Type A or Type B contactless interface. Table 1 Operation Performance Advanced Crypto Engine Modulus Exponent
Calculation Time at 5 MHz Calculation Time at 15 MHz
Modular Exponentiation Modular Exponentiation Modular Exponentiation Modular Exponentiation RSA Encrypt / RSA Signature Verify Modular Exponentiation RSA Decrypt / RSA Signature Generate Modular Exponentiation using CRT RSA Decrypt / RSA Signature Generate DSA Signature Generate DSA Signature Verify DSA Signature Generate DSA Signature Verify Elliptic Curves EC-GDSA Sign. Verify.
160 bit 256 bit 512 bit 1024 bit 1024 bit
160 bit 256 bit 512 bit 16 bit 1024 bit
20 ms 35 ms 110 ms 20 ms 820 ms
7 ms 12 ms 37 ms 7 ms 273 ms 83 ms 48 ms 43 ms 97 ms 120 ms 87 ms 183 ms
eq.1024 bit eq.1024 bit 250 ms 512 bit 512 bit 1024 bit 1024 bit 160 bit 160 bit 160 bit 160 bit 160 bit 160 bit 160 bit 145 ms 130 ms 290 ms 360 ms 260 ms 550 ms
Elliptic Curves EC-GDSA Sign. Generate 160 bit
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Features (cont'd)
Table 2 Operation Performance DDES-EC2 Accelerator Data Block Length Encryption Time for an 8-byte Block including Data Transfer 5 MHz High Speed and Secure 56-bit Single DES Encryption (incl. key loading) High Speed and Secure 56-bit Single DES Encryption 64 bit 64 bit 37 s 23 s 60 s 35 s Calculation Time 5 MHz 285 ms 540 ms 15 MHz 95 ms 180 ms 15 MHz 12 s 8 s 20 s 12 s
High Speed and Secure 64 bit 112-bit Triple DES Encryption (incl. key loading) High Speed and Secure 112-bit Triple DES Encryption 64 bit Operand Length Elliptic Curves GF(2n) EC-DSA Signature Generate 192 bit Elliptic Curves GF(2n) EC-DSA Signature Verify 192 bit
Table 3 Type
Ordering Information1 Temperature Range - 25C to + 70C Frequency Range (external clock) 13.56 MHz
SLE 66CLX641P
1
Ordering Code is available on request
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Pin Description
LA
LB
SLE 66CLX641P
Figure 1 Table 4
Pad Configuration (die) Pin Definitions and Functions
Card Contact
Symbol
LA LB
Function
Coil connection pin LA Coil connection pin LB
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General Description
The contactless only security controller SLE 66CLX641P is a member of the Infineon Technologies SLE 66CxxxP high-end security controller family in 0.22 m CMOS technology which is designed for security systems that requires continuous ongoing improvements with the highest degree of protection against fraudulent attacks. SLE 66CLX641P is targeting contactless applications such like electronic passport, electronic visas, national ID cards, banking, security access, digital signature and transport. SLE 66CLX641P offers 134 Kbytes of User-ROM, 256 bytes internal RAM, 4 Kbytes XRAM, 700 bytes Crypto RAM and 64 Kbytes EEPROM, which can be used as data and as program memory. The non-volatile memory consists of high reliability cells to guarantee data integrity. This is especially important when the EEPROM is used as program memory. It features both ISO/IEC 14443 Type A and B contactless interfaces on a single chip. It also supports symmetric and asymmetric public-key algorithm such like DES, 3DES, Elliptic Curves and RSA independently of the communication mode.
Figure 2: Block Diagram of SLE 66CLX641P The CPU provides the high efficiency of the 8051 instruction set extended by additional powerful instructions with enhanced performance, memory sizes and security features tailored for contact and contactless smart card applications. Using the embedded PLL, the internal clock is adjustable up to 15 MHz independent from the carrier frequency of the magnetic field supplied by the contactless terminal. The Memory Management Unit allows a secure separation of the operating system and the applications. Using the system/application mode, it allows to securely downloading applications in the field after card personalisation. Using the MMU transparent mode allows keeping the memory mapping for code compatibility to SLE 66CxxS family. These new features suit the requirements of the new generation of operating systems.
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Timers ease the implementation of advanced communication protocols such as T=CL (according to ISO/IEC 14443-4) and all other time critical processes for contactless communications. Both Timers features auto-reload mechanisms as well as their own dedicated interrupt vectors. Additional interrupts capability of the RF interface module allows real time operation of the pure contactless smart card with the contactless terminals. SLE 66CLX641P is able to communicate with any Proximity Card Device (PCD) defined in ISO/IEC 14443 such as the Infineon Evaluation Kit Proximity over a typical coupling distance of 10 cm. The power supply and data are received by an antenna, which consists of a coil with a few turns directly connected to the IC. DES acceleration by a factor of more than 500 compared to software solutions in combination with the high data transfer rate up to 848 Kbit/s keep the transaction times short. For more independence and flexibility, the controller offers the two modulation type A and type B according ISO/IEC 14443. The Anticollision and Contactless Transmission Protocol are supported by open source application notes for both Type A and B in order to offer a maximum flexibility to the Operating System. Both Contactless Communication protocol may be implemented in the Operating System while the final selection of the Type A or B is based upon the personalisation data of the contactless smart card. The communication type can also be changed during runtime in the field. Thus, SLE 66CLX641P ensures a simplified handling of the ROM mask, high reactivity by a tailored personalisation during production of the contactless smart card in order to answer to the increasing market demand and applications. SLE 66CLX641P features a new Resource Management System (RMS_E) which optimizes Contactless EEPROM write/erase routines. EEPROM programming is enhanced over the entire communication distance compared to the standard RMS. Thus, the reduction of programming times and power consumption is ensured independently of the use of the contact or the contactless interface. The CRC module allows the easy generation of checksums according to ISO/IEC 3309 (16-BitCRC), thus it supports the two different CRC calculation required for ISO/IEC 14443 Type A and Type B. Also, data as well as program located in the EEPROM can be extra-secured by a CRC checksum enabling the Operating System to detect errors while downloading new application in the field. To minimize the overall power consumption, the pure contactless smart card controller can be set into sleep mode. The certified random number generator (RNG) is able to supply the CPU with true random numbers on all conditions. It allows creating session key used for authentication in open networks and enable secure downloading of new applications. The DDES-EC2 accelerator consists of two modules. The DDES module supports symmetrical crypto algorithms according to the Data Encryption Standard in the Electronic Code Book Mode. It features two internal registers for storage of the two keys required for a Triple DES computation. Together with the fast contactless interface, it offers high security and high speed for contactless smart card applications. The EC2 module accelerates the multiplication in GF (2n) and therefore the operations for elliptic curve cryptography. It widens the field of application for SLE 66CLX641P since it can be used as tamper-resistant security tool for secured and authentic communication in open networks using contactless operation. The Advanced Crypto Engine (ACE) is equipped with its own RAM of 700 bytes and supports all of today known public-key algorithms based on large integer modular arithmetic. It allows fast and efficient calculation of e.g. RSA operations with key lengths up to 2048 bit and Elliptic Curve GF (p). Short Product Information 10 / 11 2004-04-27
SLE 66CLX641P
As an important feature, SLE 66CLX641P provides a new and enhanced level of on-chip security, which fulfils the strong security requirements of a Common Criteria evaluation at an EAL5 level. Each security measure is designed to act as an integral part of the complete system in order to strengthen the system as a whole. Thus, porting an existing Operating System to SLE 66CLX641P requires only very limited changes as it is typically reduced to remove the Contact-based communication library, add the Contactless Library and the Contactless Optimized Resource Management System (RMS_E) to the existing Operating System. SLE 66CLX641P integrates outstanding memory sizes, additional peripherals in combination with enhanced performance and optimized power consumption on a minimized die size. In conclusion, SLE 66CLX641P fulfils the requirements of contactless applications such electronic passport, electronic visas, national ID cards, banking, security access, digital signature and transport. In the case a dual interface security controller is required, SLE 66CLX640P offers an additional contact-based interface to the SLE 66CLX641P.
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